BYD Semiconductor Co., Ltd. (Securities abbreviation: BYD) announced that the application for splitting its subsidiary BYD Semiconductor Co., Ltd. to be listed on the gem was accepted by Shenzhen Stock Exchange.
According to the announcement, BYD plans to spin off its subsidiary BYD Semiconductor Co., Ltd. (hereinafter referred to as “BYD semiconductor”) to be listed on the growth enterprise market of Shenzhen Stock Exchange (hereinafter referred to as “this spin off”). BYD semiconductor has recently submitted the application materials for the spin off to Shenzhen Stock Exchange, and received the notice on accepting the application documents for the IPO of BYD Semiconductor Co., Ltd. and listing on the gem issued by Shenzhen Stock Exchange on June 29, 2021 (SZS  No. 283). Shenzhen Stock Exchange, in accordance with relevant regulations, checked the application report and relevant application documents submitted by BYD semiconductor for IPO and listing on the growth enterprise market, considered that the documents were complete, and decided to accept it.
According to the announcement, the spin off still needs to meet a number of conditions before it can be implemented, including but not limited to obtaining the consent of the stock exchange of Hong Kong Limited, passing the examination of Shenzhen Stock Exchange and the approval of China Securities Regulatory Commission for registration, which has significant uncertainty. The company will, according to the progress of relevant matters and in strict accordance with the provisions and requirements of laws and regulations, perform the obligation of information disclosure in a timely manner. Investors are invited to pay attention to investment risks.
Data source: Enterprise Search
According to the enterprise survey data, BYD semiconductor was founded on October 15, 2004, with a registered capital of 450 million yuan, and its legal representative is Chen Gang. The company is committed to the development of integrated circuits and power devices. At present, its products mainly cover power semiconductor devices, IGBT power modules, power management ICs, CMOS image sensors, sensing and control ICs, audio and Video Processing ICs, etc. BYD is its major shareholder, holding 72.3015%.
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